SM-4205

In semiconductor lithography processes, surfactants are added to deionized water to reduce surface tension and form a low surface energy protective film on the coating surface of the lithography machine, thereby reducing the collapse of photoresist patterns caused by capillary forces of water. By adding surfactants to the rinse solution to lower its surface tension and form a low surface energy protective film on the coating surface, the collapse of patterns can be prevented. This can achieve a higher aspect ratio of the patterns and improve the roughness of the sidewall edges of the patterns.